インテルのインスタグラム(intel) - 2月26日 04時48分

As data rates and high-bandwidth demands increase such as with large-capacity external storage, and high res displays the need for speed to keep up is very apparent. This image of a research project to address those issues shows platform interconnects and input/output circuits with industry-leading energy efficiency and scalable performance. This technology, offering 205mW 32Gb/s Bi-directional Serial Link in 22nm CMOS was presented in a research paper from Intel Labs. #Intel #Technology #TechIsBeautiful #Experiences. Photo Credit: @thewhalen99

[BIHAKUEN]UVシールド(UVShield) 更年期に悩んだら

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